住友环氧树脂 粘合剂 继电器用 日本住友 ECR-9250K 中等粘度
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Physical PropertiesMetricEnglishCommentsMechanical PropertiesMetricEnglishCommentsElectrical PropertiesMetricEnglishCommentsThermal PropertiesMetricEnglishComments
Specific Gravity 1.40 g/cc 1.40 g/cc
Water Absorption 0.40 % 0.40 % wt%; 2 hrs soaking; boiling; Cured Material
Viscosity 20000 cP
@Temperature 25.0 °C 20000 cP
@Temperature 77.0 °F
Hardness, Shore D 88 88 Cured Material
Flexural Strength 83.0 MPa
@Temperature 25.0 °C 12000 psi
@Temperature 77.0 °F Cured Material
Flexural Modulus 5.00 GPa
@Temperature 25.0 °C 725 ksi
@Temperature 77.0 °F of elasticity; Cured Material
Adhesive Bond Strength 9.00 MPa 1310 psi Cu/Cu; Cured Material
10.0 MPa 1450 psi LCP/LCP; Cured Material
Volume Resistivity 1.00e+16 ohm-cm 1.00e+16 ohm-cm Cured Material
CTE, linear, Parallel to Flow 40.0 µm/m-°C 22.2 µin/in-°F Cured Material
Glass Transition Temp, Tg 150 °C 302 °F Cured Material
Specific Gravity 1.40 g/cc 1.40 g/cc
Water Absorption 0.40 % 0.40 % wt%; 2 hrs soaking; boiling; Cured Material
Viscosity 20000 cP
@Temperature 25.0 °C 20000 cP
@Temperature 77.0 °F
Hardness, Shore D 88 88 Cured Material
Flexural Strength 83.0 MPa
@Temperature 25.0 °C 12000 psi
@Temperature 77.0 °F Cured Material
Flexural Modulus 5.00 GPa
@Temperature 25.0 °C 725 ksi
@Temperature 77.0 °F of elasticity; Cured Material
Adhesive Bond Strength 9.00 MPa 1310 psi Cu/Cu; Cured Material
10.0 MPa 1450 psi LCP/LCP; Cured Material
Volume Resistivity 1.00e+16 ohm-cm 1.00e+16 ohm-cm Cured Material
CTE, linear, Parallel to Flow 40.0 µm/m-°C 22.2 µin/in-°F Cured Material
Glass Transition Temp, Tg 150 °C 302 °F Cured Material
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